multi-layer gold plating PCB
Materials: FR4
Board thickness: 1.6mm
Surface technique: plating gold + white legend
Minimum hole size: 0.20mm
Minimum Line/Space: 0.10mm/0.10mm
Thermal Temperature:288 C.degree
BGA,Gold Finger
Materials: FR4
Board thickness: 1.6mm
Surface technique: plating gold + white legend
Minimum hole size: 0.20mm
Minimum Line/Space: 0.10mm/0.10mm
Thermal Temperature:288 C.degree
BGA,Gold Finger
Specifications
- multi-layer PCB board
- FR-4
- 4 Layers PCB.
- 1.6mm thickness.
- Hard gold thickness: 5 micro inch
- HAL finished.
- Normal lead-time: 6 working days
- The working day will start after the CAM checking process
Main Products
PCB/FPC design,manufacture,SMT/DIP(OEM/ODM)