2-4 Layers High TG COB Substrate
Line Width / space : 0.1/0.1mm
Immersion nickel/Gold
Material: able to bear high temperature and keep its Dem-ension Stability.
Line Width / space : 0.1/0.1mm
Immersion nickel/Gold
Material: able to bear high temperature and keep its Dem-ension Stability.
Main Products
Rigid and flexible printed circuit board