We are well experienced in the latest trends in bonding technologies, namely TAB (tape automated bonding) and COG (chip on glass). Both these technologies reduce the size of the LCD driving electronics and achieve a finer pitch in connecting the LCD drive to the LCD glass. As a result TAB and COG technologies make LCD modules smaller, lighter, and increase their portability. Applications: note book PCs, personal digital assistants, word processors, digital cameras, global positioning system, cellular phones, etc.
Features
- COB (chip on board)
- SMT (surface mounted technology)
- TAB (tape automated bonding)
- COG (chip on glass)
Main Products
glass bulb, TN LCD, STN LCD, FSTN LCD, ECB LCD, SSCT LCD, black mask LCD, LCD module