"REDSUN" Tin Soldering Paste is developed for the purpose of N2 Refold Soldering of high identified base plate or electronic machines and appliances. This paste is made of well mixed powder from tin soldering manufacture and high viscosity soldering manufacture and high viscosity soldering doze. It has appropriate chxotropy and dispenser when used on printing and ejecting. After being printed, it can keep long-time adhensivity and make the base mount engineering easier. The tin soldering power is manufactured from non-oxidized moist powder by exclusive R.S. approach. Therefore, when utilized, ig will not have the phenomenon of tin ball . according to application purpose. We have to types for customers option, one is common particle powder and the other is ball-shape super micro powder particle.
Features
- Long tackiness after printing.
- Can be stored up to 48 hours in normal temperature.
- Surpassed chxotropy and print-ability.
- High stability for storage(It still works after taking from ice box. After 3 months of producing).
Main Products
solder bar, solder wire, flux, thinner, solder paste, electric component, auto machine equipment, motor.