Material:Hi-Tg (170℃)、FR-4
Layer Coverage:10 Layers
Thickness:1.6 mm
Surface Technique:Immersion Gold
Specialty:Copper Weight 105 um
Blind-via/Buried-via
Larger Current
Layer Coverage:10 Layers
Thickness:1.6 mm
Surface Technique:Immersion Gold
Specialty:Copper Weight 105 um
Blind-via/Buried-via
Larger Current
Certificate
- UL、CE
Main Products
PCB printing / PCBA / SMT / wave soldering / OEM / ODM / assemblysales