Specifications:
Applicable PCB (L x W): 50 × 50 to 700 × 460mm
Minimum component: 0201
Minimum QFP pitch: 0.4mm
Minimum IC pitch: 0.30mm.
Minimum BGA ball diameter: 0.40mm
Ball pitch: 1.0mm
Maximum BGA size: 74x74mm
Service include: PCB layout and BOM design or copying, component procurement, SMT, DIP, enclosure assembly, test, and packing
Mounting capability: 9,000,000 chips a day
DIP: 700,000 pieces a day
We are planning to prepare 2 lines more this year
Applications of our product: SMPS, PCI, mother board, controller, CCTV, telecommunication, DVD, MP3, GPRS, military, and more
Primary competitive advantages:
Shenzhen has the biggest electronic market
We can procure most of component in the shortest at the lowest price
We have good business relationship with main IC manufacturers, such as NS, TI, ON, Fairchild, ST, microchip, and more
We have our own PCB factory, can offer one stop service for client
Our employees are experienced and stable
High-precision machine a