EMI shield films, the UF5G-75 series, come in the industrys first two layer constitution, which was enabled by the use of a special urethane resin developed by us.
A high EMI shield effect is achieved by the dispersion of conductive filler in the heat-resistant adhesive (urethane resin).
Consisted of flexible, heat-resistant resins, they boast high folding endurance, flexibility, and heat-shrinkable properties. This makes them an outstanding EMI shield material for FPC, electronic components, and the like.