HDI(High Density Interconnector) is defined as a printed circuit board with a diameter of less than 6mil, Hole Pad of less than 0.25mm, contact Density of more than 130 points per square inch, wiring Density of more than 117 "per square inch, and line width/spacing of less than 3mil/3mil. According to the use of advanced HDI board, 5G board or IC board, its future growth is very fast.
Reduce the cost
Increase wiring density
It is beneficial to the use of advanced packaging technology
Better electrical performance and signal accuracy
Better reliability
The thermal properties can be improved
can improve radio frequency interference
electromagnetic interference,static electricity release
Increasedesign efficiency
Reduce the cost
Increase wiring density
It is beneficial to the use of advanced packaging technology
Better electrical performance and signal accuracy
Better reliability
The thermal properties can be improved
can improve radio frequency interference
electromagnetic interference,static electricity release
Increasedesign efficiency
Main Products
PCB,SMT,DIP,PCB Assembly