Standard Specification
Layers: 1 – 12 layers
Material: FR4, Aluminum
Board thickness: 0.4 –2.4mm
Minimum drill diameter: 0.2mm
Minimum track/gap: 3/3mil
Surface Finishing: HASL,HASL LF,OSP, ENIG, immersion tin, immersion silver)
Copper thickness:18 – 105 um (0.5-3oz)
Maximum size:1 – 2 sided 1200*600mm, Multilayer 600*600mm
Hole: Thru holes,Blind hole,Buried vias,micro vias, countersunk, back drill depth, Castellated holes.
Aspect ratio: 10:1
Soldermask: green, yellow, red, blue, white, black
Legend: green, yellow, red, blue, white, black
Contour: Routing, CNC scoring, pressing
Data format: Gerber, X-Gerber, Gerber 247X + Excellon Sieb & Meyer, ODB++
Testing: Speedy Flying Probe, E-test fixture
Approval:SO/TS 16949:2009/ ISO9001:2008 /UL
Layers: 1 – 12 layers
Material: FR4, Aluminum
Board thickness: 0.4 –2.4mm
Minimum drill diameter: 0.2mm
Minimum track/gap: 3/3mil
Surface Finishing: HASL,HASL LF,OSP, ENIG, immersion tin, immersion silver)
Copper thickness:18 – 105 um (0.5-3oz)
Maximum size:1 – 2 sided 1200*600mm, Multilayer 600*600mm
Hole: Thru holes,Blind hole,Buried vias,micro vias, countersunk, back drill depth, Castellated holes.
Aspect ratio: 10:1
Soldermask: green, yellow, red, blue, white, black
Legend: green, yellow, red, blue, white, black
Contour: Routing, CNC scoring, pressing
Data format: Gerber, X-Gerber, Gerber 247X + Excellon Sieb & Meyer, ODB++
Testing: Speedy Flying Probe, E-test fixture
Approval:SO/TS 16949:2009/ ISO9001:2008 /UL
Main Products
PCB, printed circuit boards prototype, low volume high mixed PCB