Electrical Insulation Polyimide Film for Flexible Printed Circuit Board
Product ID: 25PI
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Standard of Performance
Thickness 25um
Tensile strength(TD) ≥170Mpa
Tensile strength(MD)≥165Mpa
Elongation≥40 %
Youngs Modulus≥3.1Gpa
Dielectric Constant 3.5±0.4
Dissipation Factor≤0.004
Volume Resistivity>10^12
Surface Resistivity>10^14
Dielectric Strength≥200 v/um
Thermal Expansivity 25±3ppm/℃
Shrinking Percentage ≤0.12%
Hydroscopicity ≤2.2%
Density 1.44±0.2g/cm³
Wetting Tension 58mN/m
Thickness 25um
Tensile strength(TD) ≥170Mpa
Tensile strength(MD)≥165Mpa
Elongation≥40 %
Youngs Modulus≥3.1Gpa
Dielectric Constant 3.5±0.4
Dissipation Factor≤0.004
Volume Resistivity>10^12
Surface Resistivity>10^14
Dielectric Strength≥200 v/um
Thermal Expansivity 25±3ppm/℃
Shrinking Percentage ≤0.12%
Hydroscopicity ≤2.2%
Density 1.44±0.2g/cm³
Wetting Tension 58mN/m
Main Products
Polyimide film