1) Layer count: Single Layer, Double sided, Multi-Layers up to 26 Layers
2) Board finished thickness: 0.2mm, 1.0mm, 1.6mm, and 2.0mm to 4.0 mm
3) Material: FR-4, CEM-1, CEM-3, High Tg, High Frequency, Aluminum Base
4) Copper thickness: 0.5oz, 1oz, 2oz,3oz,4oz
5) Conductor width and space: 3mil/3mil
6) Surface treatment: HASL, Lead-free HASL, OSP/ENTERK, Immersion Gold/Tin/Silver
7) Solder Mask /Resist: LPI Green, Red, Yellow, Black, White, Blue
8) Profiling: Punching, Routing, V-Cut, Beveling
9)Special Requirement: BGA,HDI ,Impendence Control, Gold Finger, Blind & Buried Via holes, Carbon Ink Printing, Peel able Mask, Countersink, Back Panel
10)Application: Amplifier, Speaker, Antenna, guitar electronics, position indicators, controllers, memory products, networking, wireless communications, LED, LCD, Voice announcement system, Monitors, Radio and TV digital cameras CCD and CMOS-cameras communication devices, ESD measurement tools, housing electronics, Remote control