Our 10 years’ manufacturing experience, the use of Laser-direct Imaging,
laser drilling and contouring, high layer count lamination processing equipment, pulse plating and other specialized equipment factory-wide enables Ausay to produce 40 layer and above rigid boards and rigid-flex circuits up to 20 layers. Backplane thicknesses up to .276 (7mm), aspect ratios up to 20:1, 2/2 line/space and impedance controlled designs are produced daily.