Features
Thin Film structure design with ceramic body and copper & tin alloy element
Offer wide range of current ratings from 0.2A-7 A & voltage up to 63 VDC and 32 VAC
Special multi-layer construction makes the fusing characteristics stable
Good explosion-proof & Scratch durable characteristics
Suitable for both lead / lead-free reflow and wave soldering process
Products meet 100% RoHS, HF & REACH requirement
Operating temperature range: -55°C to +125°C
Thin Film structure design with ceramic body and copper & tin alloy element
Offer wide range of current ratings from 0.2A-7 A & voltage up to 63 VDC and 32 VAC
Special multi-layer construction makes the fusing characteristics stable
Good explosion-proof & Scratch durable characteristics
Suitable for both lead / lead-free reflow and wave soldering process
Products meet 100% RoHS, HF & REACH requirement
Operating temperature range: -55°C to +125°C
Main Products
Surface Mount Fuses(SMD)/Sub-MINIATURE Fuses/Micro Fuses/Electronic Fu