DBC substrate
As a new and high capability substrate, DBC substrates have been used widely in electric power and electronic industry.
The high thermal conductivity of Al2O3 (24W/mK) and AIN(180W/mK) combined with the high thermal capability of thick
high purity copper(typically 0.2mm or 0.3mm thick copper) make DBC the most popular material choice for power chip on
board assemblies.
The high thermal conductivity of Al2O3 (24W/mK) and AIN(180W/mK) combined with the high thermal capability of thick
high purity copper(typically 0.2mm or 0.3mm thick copper) make DBC the most popular material choice for power chip on
board assemblies.
Main Products
DBC substrate