Features:
Machine body is made of high accuracy top quality a luminum, further rigidness foundry, and fully anti- aging treatment.
Constant temperature heating, automatic feeding and adjusting, CCD and tri-coordinate regulation and alignment, integrative COG bonding architecture accomplishing , each bonding procedure only takes 6-8 seconds.
Computer control unit system, large capacity storage space, multifunctional switching operation.
17-inch LCD display and camera interface perfectly decrease the operation complexity.
High accuracy, high stability imported parts ensure the equipment quality.
Ideal design, beautiful appearance, low power consumption, high efficiency and low noise.
Applicable for COG bonding ≦ 7 inches diagonal.
Specification:
Control System ASUS PCBOND HEAD Exclusive PC
Operating Interface BENQ-17TFTLCD/WINDOWS XP
Time Range 1-100 seconds
Throughput 500-600PCS/H
Bond Head Accuracy ≤ 5um
Temperature Range RT-500 Degree Celsius
Pressure Range 3.0-7.0kgf
Stroke Accuracy ± 0.03mm
Product Min Pitch pitch ≥ 10um
Product Max Size 7 inches diagonal
Alignment Min Width 3mm
CCD Magnification 180 X -250 X
Power 2KW
Thermocouple K TYPE
Weight 350KG
Dimension (L) 840mm × (W) 600mm × (H) 1650mm
Machine body is made of high accuracy top quality a luminum, further rigidness foundry, and fully anti- aging treatment.
Constant temperature heating, automatic feeding and adjusting, CCD and tri-coordinate regulation and alignment, integrative COG bonding architecture accomplishing , each bonding procedure only takes 6-8 seconds.
Computer control unit system, large capacity storage space, multifunctional switching operation.
17-inch LCD display and camera interface perfectly decrease the operation complexity.
High accuracy, high stability imported parts ensure the equipment quality.
Ideal design, beautiful appearance, low power consumption, high efficiency and low noise.
Applicable for COG bonding ≦ 7 inches diagonal.
Specification:
Control System ASUS PCBOND HEAD Exclusive PC
Operating Interface BENQ-17TFTLCD/WINDOWS XP
Time Range 1-100 seconds
Throughput 500-600PCS/H
Bond Head Accuracy ≤ 5um
Temperature Range RT-500 Degree Celsius
Pressure Range 3.0-7.0kgf
Stroke Accuracy ± 0.03mm
Product Min Pitch pitch ≥ 10um
Product Max Size 7 inches diagonal
Alignment Min Width 3mm
CCD Magnification 180 X -250 X
Power 2KW
Thermocouple K TYPE
Weight 350KG
Dimension (L) 840mm × (W) 600mm × (H) 1650mm
Main Products
Heat Bonding chines, ACF Tacking Machines, Polarizer Equipments