picture of silicon wafer wet etching & washing machine
KZ-Silicon Wafer Wet Etching & Washing Machine（30/60MW）
Type: KZ-LS-PSG(30/60MW)
Used for monosilicon/ polysilicon cell process line of etching and PSG removal. (auto load& unload unit optional)
Features:
1. Uniform and precise etching
2. Patent drive system, low fragmentation rate
3. Patent drive rails, no washing streaks
4. Patent ventilation system, stable and inclusion-free air current
5. Low chemical consumption rate, nice water-saving performance
6. Perfect process monitoring system and visual operation interface
7. Precise control of reaction temperature, reliable thermostatic device
8. Automatic supplement of chemical consumed, dependable concentration control
Technical Parameters
Description Etching and PSG Removal
Products Polysilicon wafers /
Monosilicon wafers 156mm*156mm*0.2mm
125mm*125mm*0.2mm
Capacity Number of convey lanes 5
125mm*125mm 3600pcs/hr
156mm*156mm 3600pcs/hr
Fragmentation rate ≤2‰
Working Direction L-R or R-L(as customers’ requirement)
Working Speed Speed range 1.0-2.0m/min
Operation Speed 1.8m/min
Operating height 930mm±30mm
Machine
Configuration Module material PVDF, Nature PP
Main drive material Ti, SUS316
Shaft material PVDF, Nature PP
Axle Pitch 50mm
Facility condition Power 30kw,380V,3phase 5wire, 50Hz
DI Water 2.5±0.5kgf/㎝2
CDA/N2 6±0.5kgf/cm2
ⅠHigh EfficiencyⅡHigh Quality ⅢLow price
----------------------------------
Wendy Zhang
Hotline: 86-512-52992666-8010
MSN:wendy.zhang.kzonetech@msn.cn
Type: KZ-LS-PSG(30/60MW)
Used for monosilicon/ polysilicon cell process line of etching and PSG removal. (auto load& unload unit optional)
Features:
1. Uniform and precise etching
2. Patent drive system, low fragmentation rate
3. Patent drive rails, no washing streaks
4. Patent ventilation system, stable and inclusion-free air current
5. Low chemical consumption rate, nice water-saving performance
6. Perfect process monitoring system and visual operation interface
7. Precise control of reaction temperature, reliable thermostatic device
8. Automatic supplement of chemical consumed, dependable concentration control
Technical Parameters
Description Etching and PSG Removal
Products Polysilicon wafers /
Monosilicon wafers 156mm*156mm*0.2mm
125mm*125mm*0.2mm
Capacity Number of convey lanes 5
125mm*125mm 3600pcs/hr
156mm*156mm 3600pcs/hr
Fragmentation rate ≤2‰
Working Direction L-R or R-L(as customers’ requirement)
Working Speed Speed range 1.0-2.0m/min
Operation Speed 1.8m/min
Operating height 930mm±30mm
Machine
Configuration Module material PVDF, Nature PP
Main drive material Ti, SUS316
Shaft material PVDF, Nature PP
Axle Pitch 50mm
Facility condition Power 30kw,380V,3phase 5wire, 50Hz
DI Water 2.5±0.5kgf/㎝2
CDA/N2 6±0.5kgf/cm2
ⅠHigh EfficiencyⅡHigh Quality ⅢLow price
----------------------------------
Wendy Zhang
Hotline: 86-512-52992666-8010
MSN:wendy.zhang.kzonetech@msn.cn
Certificate
- ISO9001
Main Products
Polysilicon Wafer Texture & Washing Machine Silicon Wafer Wet Etching