KZ-Automatic De-PSG Cleaning Machine
Type: KZ-DE-PSG
For silicon cell process line of removing phosphorosilicate glass(PSG) after phosphorus diffusion.
Advantages：
1 Classic tank structure, convenient to maintain
2 Servo drive system ensuring lifting and sliding in speed and stability
3 Custom-made allowed process and dry mode
4 Perfect process monitoring system, with automatic temperature control and chemical supplement
5 friendly visual operate interface, for parameter setting, step control, process switch, etc
Usage
The main function is to remove PSG on the surface of silicon wafers after etching.
Wafer size: 125*125*0.20mm/ 156*156*0.20 mm
Maximum output: 1600 pcs/hour
Maximum capacity per batch: 200 pcs
Takt time: 450 second
Maximum size of 200 wafer box: 730*410*210 mm

Technical Parameters
Description PSG removal 　
Products Polysilicon wafers/ Monosilicon wafers 156*156*0.2 mm
125*125*0.2 mm
Capacity Takt time 450sec（as customers requirement）
125mm*125mm 2400 pcs/hour
156mm*156mm 1600 pcs/hour
Fragmentation rate