picture of automatic monosilicon wafer acid-texturing rinse machine
KZ-Automatic Monosilicon Wafer Acid-texturing Rinse Machine
Type: KZ-LS-MWA
For monosilicon cell process line of mechanical damage surface layer removal, washing, and texturing.
Advantages：
1 Classic tank structure, convenient to maintain
2 Servo drive system ensuring lifting and sliding in speed and stability
3 Custom-made allowed process and dry mode
4 Perfect process monitoring system, with automatic temperature control and chemical supplement
5 friendly visual operate interface, for parameter setting, step control, process switch, etc
Usage
The main function is to carry out pre-diffusion process of removing the mechanical damage in surface layer, eliminating oil contamination and metal impurities outside, forming the undulating skin so as to increase the absorption of sunlight, and drying out. The processes of removing damage layer, cleaning and drying are accomplished in the same device. It’s a fully automatic device.
Dimension(reference): L412400*W2165*H2230
Wafer size: 125*125*0.20 mm / 156*156*0.20 mm
Maximum output: 1600 pcs/hour
Maximum capacity per batch: 200 pcs
Takt time: 450 second (depending on actual technique)
Technical Parameters
Description texture & acid rinse
Products Monosilicon wafers 156*156*0.2 mm
125*125*0.2 mm
Capacity Takt time 450sec（as customers requirement）
125mm*125mm 2400 pcs/hour
156mm*156mm 1600 pcs/hour
Fragmentation rate
Type: KZ-LS-MWA
For monosilicon cell process line of mechanical damage surface layer removal, washing, and texturing.
Advantages：
1 Classic tank structure, convenient to maintain
2 Servo drive system ensuring lifting and sliding in speed and stability
3 Custom-made allowed process and dry mode
4 Perfect process monitoring system, with automatic temperature control and chemical supplement
5 friendly visual operate interface, for parameter setting, step control, process switch, etc
Usage
The main function is to carry out pre-diffusion process of removing the mechanical damage in surface layer, eliminating oil contamination and metal impurities outside, forming the undulating skin so as to increase the absorption of sunlight, and drying out. The processes of removing damage layer, cleaning and drying are accomplished in the same device. It’s a fully automatic device.
Dimension(reference): L412400*W2165*H2230
Wafer size: 125*125*0.20 mm / 156*156*0.20 mm
Maximum output: 1600 pcs/hour
Maximum capacity per batch: 200 pcs
Takt time: 450 second (depending on actual technique)
Technical Parameters
Description texture & acid rinse
Products Monosilicon wafers 156*156*0.2 mm
125*125*0.2 mm
Capacity Takt time 450sec（as customers requirement）
125mm*125mm 2400 pcs/hour
156mm*156mm 1600 pcs/hour
Fragmentation rate
Certificate
- ISO9001
Main Products
Polysilicon Wafer Texture & Washing Machine Silicon Wafer Wet Etching