Material: FR4
0.3mm QFP pitch
Layer count: 6
Board thickness: 1.6mm
Surface technique: HAL lead-free
Minimum hole size: 0.15mm
Copper thickness: 1.0z
Solder mask: green
Application field: electronic appliance board
0.3mm QFP pitch
Layer count: 6
Board thickness: 1.6mm
Surface technique: HAL lead-free
Minimum hole size: 0.15mm
Copper thickness: 1.0z
Solder mask: green
Application field: electronic appliance board
Main Products
PCB, PCBA, plastic case, final assembly