1,electronic contract manufacturing
2,Provide Functionality Testing,
3, 0201 to uBGA SMT
4, Final Product Assembly
electronic contract manufacturing
1, Vision aligned solder paste deposition
2, 0201 to uBGA SMT placement capability
3, Pin In Paste (Intrusive Reflow)
4, High velocity forced hot air reflow systems
5, Light-guided work stations for conventional thru-hole PCB assembly
6, Latest dual wave, flow soldering equipment
7, Programmable Selective Soldering
8, Analogue, Digital, RF and Functional test development, operation and debug In house FPGA and EPROM programming
9 , Workmanship to IPC-610 class 3 or MIL STD 2000 equivalent
10, Assemble your printed circuit boards into finished product box assemblies
11, Provide cabinet, rack and backplane wired assemblies
12, Press-fit connectors into high density PCBs & Backplanes
13, Provide in house FPGA and EPROM programming facilities
14, Assemble complex cable forms & harnesses
15, Carry out potting, encapsulation and heat shrinking
16, Provide automated cut and strip facilities to ensure accuracy of wire processing
17, Carry out semi-automated wire wrapping of complex assemblies
18, Provide service and repair facilities for product refurbishment and upgrade
19, Provide Functionality Testing,
20, Well package and storage and ready to ship
2,Provide Functionality Testing,
3, 0201 to uBGA SMT
4, Final Product Assembly
electronic contract manufacturing
1, Vision aligned solder paste deposition
2, 0201 to uBGA SMT placement capability
3, Pin In Paste (Intrusive Reflow)
4, High velocity forced hot air reflow systems
5, Light-guided work stations for conventional thru-hole PCB assembly
6, Latest dual wave, flow soldering equipment
7, Programmable Selective Soldering
8, Analogue, Digital, RF and Functional test development, operation and debug In house FPGA and EPROM programming
9 , Workmanship to IPC-610 class 3 or MIL STD 2000 equivalent
10, Assemble your printed circuit boards into finished product box assemblies
11, Provide cabinet, rack and backplane wired assemblies
12, Press-fit connectors into high density PCBs & Backplanes
13, Provide in house FPGA and EPROM programming facilities
14, Assemble complex cable forms & harnesses
15, Carry out potting, encapsulation and heat shrinking
16, Provide automated cut and strip facilities to ensure accuracy of wire processing
17, Carry out semi-automated wire wrapping of complex assemblies
18, Provide service and repair facilities for product refurbishment and upgrade
19, Provide Functionality Testing,
20, Well package and storage and ready to ship
Main Products
Electronics & Plastics manufacturing services