Feature:
Open top chip scale package.
Accommodates pitch size of 0.5mm.
Compact size and low actuation force.
4-point pinch design for enhanced electrical contact.
Field exchangeable package location plate.
“U”contact support any type of solder ball shape and composition.
Compatible solder ball & non-solder ball testing
Open top chip scale package.
Accommodates pitch size of 0.5mm.
Compact size and low actuation force.
4-point pinch design for enhanced electrical contact.
Field exchangeable package location plate.
“U”contact support any type of solder ball shape and composition.
Compatible solder ball & non-solder ball testing
Main Products
eMMC socket,BGA/LGA socket,DDR test fixture,POP/BGA reballing