Feature :
Clamshell with Patented structure, zero abrasion.
Contact with GCR, no pad and IC get burned.
High frequency :>1600Hz
Over pressure protection, make conductive adhesive longer life span.
Pressure self-adaption, compatible diverse chips with different thickness.
Frame guide is changeable, compatible different IC with different size.
Clamshell with Patented structure, zero abrasion.
Contact with GCR, no pad and IC get burned.
High frequency :>1600Hz
Over pressure protection, make conductive adhesive longer life span.
Pressure self-adaption, compatible diverse chips with different thickness.
Frame guide is changeable, compatible different IC with different size.
Main Products
eMMC socket,BGA/LGA socket,DDR test fixture,POP/BGA reballing