BGA510C rework station, CCD camera, LCD display
Rework station BGA500 of GLICHN, 3 zones with chinese and english touching screen, 3 groups of
temperature profiles can be show at the same time, 30 groups of temperature data can be stored.BGA,
CSP, LGA( Land Grid Array), Micro SMD, MLF (Micro-Lead Frame ),BCC ( Bumped Chip Component )
and other chips can be deal. it is best equipment for PCB especially large PCB.
parameters of BGA500
1 power consumption: 5000W
2 top power: 800 W
3 bottom power: 800 W
4 bottom infrared preheating: 3000W
5 power supply: AC220V 50/60HZ or 110V
6 dimension: L710mmⅹW680mmⅹH660mm
7 min PCB: 40mmⅹ40mm
8 max PCB size: 400×450mm
features of BGA500
1 with touching screen, PLC control, 3 temperature profiles can be show, the accuracy of temperature is
±1.
2 7 segments temperature controling, preheating,heat preservation, warm-up, welding1, welding 2,
dropping temperature, cooling can be set.
3 1-30 groups can be stored, on the touching screen profiles can be analysed and changed.
4 3 zones heat independently, multi-group, multi-segment temperature can be done in first and second
zones, PCB will heat in the third zone. heating time, time, slope, cooling, alarm will be showed in touching
screen.
5 with K thermocouple, with testing temperature connector to test temperature.
6 with alarm function after welding BGA, it can cut off when temperature is abnormality, with protection
function when it is over temperature.
7 crosscurrent air motor can make PCB ametabolic.
8 locating PCB with V slot, omnipotent clamp can protect PCB.
9 it can deal with large capacity PCB, high temperature, lead free BGA/CSP and pillar BGA.
10 nozzle can rotate 360, it is easy to replace. with different nozzle.
11 it can deal with large capacity PCB, high temperature and lead free welding.
temperature profiles can be show at the same time, 30 groups of temperature data can be stored.BGA,
CSP, LGA( Land Grid Array), Micro SMD, MLF (Micro-Lead Frame ),BCC ( Bumped Chip Component )
and other chips can be deal. it is best equipment for PCB especially large PCB.
parameters of BGA500
1 power consumption: 5000W
2 top power: 800 W
3 bottom power: 800 W
4 bottom infrared preheating: 3000W
5 power supply: AC220V 50/60HZ or 110V
6 dimension: L710mmⅹW680mmⅹH660mm
7 min PCB: 40mmⅹ40mm
8 max PCB size: 400×450mm
features of BGA500
1 with touching screen, PLC control, 3 temperature profiles can be show, the accuracy of temperature is
±1.
2 7 segments temperature controling, preheating,heat preservation, warm-up, welding1, welding 2,
dropping temperature, cooling can be set.
3 1-30 groups can be stored, on the touching screen profiles can be analysed and changed.
4 3 zones heat independently, multi-group, multi-segment temperature can be done in first and second
zones, PCB will heat in the third zone. heating time, time, slope, cooling, alarm will be showed in touching
screen.
5 with K thermocouple, with testing temperature connector to test temperature.
6 with alarm function after welding BGA, it can cut off when temperature is abnormality, with protection
function when it is over temperature.
7 crosscurrent air motor can make PCB ametabolic.
8 locating PCB with V slot, omnipotent clamp can protect PCB.
9 it can deal with large capacity PCB, high temperature, lead free BGA/CSP and pillar BGA.
10 nozzle can rotate 360, it is easy to replace. with different nozzle.
11 it can deal with large capacity PCB, high temperature and lead free welding.
Main Products
SMT equipments, BGA rework station, PCB handle equipments, THT machine