PCBA for bluetooth products1
1.Surface Mount Technology
Single/Double Sided SMT
Minimum chip size component: 0201
Standard chip size component: 0603 and larger
ICs - SOICs, SSOPs, QFPs
Fine Pitch ICs : pitch less than 0.021
BGAs, uBGA
Convection & IR Reflow Solder
2.Through Hole (TH)
Manual Insertion
Automated Pin Insertion
Manual Soldering
Wave&re-flow Soldering
3.Test:functional, ICT, Flying Probe, test programming,
cable scan,AOI x-ray inspection,BGA rework device
4.No MOQ
We will reply you within 5hours,and quote to you within 3days.
Single/Double Sided SMT
Minimum chip size component: 0201
Standard chip size component: 0603 and larger
ICs - SOICs, SSOPs, QFPs
Fine Pitch ICs : pitch less than 0.021
BGAs, uBGA
Convection & IR Reflow Solder
2.Through Hole (TH)
Manual Insertion
Automated Pin Insertion
Manual Soldering
Wave&re-flow Soldering
3.Test:functional, ICT, Flying Probe, test programming,
cable scan,AOI x-ray inspection,BGA rework device
4.No MOQ
We will reply you within 5hours,and quote to you within 3days.
Certificate
- ISO9001:2008
Main Products
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