Flash gold (Electrolytic), Hard gold plating,
Electroless nickel Immersion gold (Electroless Ni/Au),
Organic Solderability Preservatives (Entek), Hot Air Leveling (Tin/Lead),
Hot Air Leveling (Pb Free),
Carbon Ink, Peelable Mask. Gold Fingers, Silver Paste
Electroless nickel Immersion gold (Electroless Ni/Au),
Organic Solderability Preservatives (Entek), Hot Air Leveling (Tin/Lead),
Hot Air Leveling (Pb Free),
Carbon Ink, Peelable Mask. Gold Fingers, Silver Paste
Features
Multi-layer PCB^$^#Main Products
PCB, PWB, Multi-layer PCB