A gel filled IDC module designed for mounting in housing on standard DIN rails. With 3-pin footprint in an always-closed position - no bridge module required to complete circuit.
Applications
˙Designed for mounting on standard DIN rails.
˙DIN rail doubles as an earth point.
Applications
˙Designed for mounting on standard DIN rails.
˙DIN rail doubles as an earth point.
Specifications
- Drop Wire connector
- Gauge range: 0.4 to 1.2 mm diameter
- Insulation diameter: 5mm maximum diameter
- Customer Wire connector
- Gauge range: 0.4 to 1.2 mm diameter
- Insulation diameter: 3mm maximum diameter
- Electrical Specifications
- Insulation resistance: >10GΩ
- Contact resistance: ≤10 mΩ
- Dielectric strength: >3.000 Vdc for 1 minute
- MATERIALS
- Drop wire housing body: Transparent polycarbonate
- Body : V0 reinforced polycarbonate
- Insertion contacts: Tinned phosphor bronze
- Lower sealant: Epoxide resin
- Upper cable sealant: Silicone fluid
- Pair/drop wire bearing cover: Polycarbonate
- "O" ring: EPDM
- Spring: Stainless steel
- Cable/drop wire sealant: Thermoplastic rubber
Features
- Installation displacement (IDC) typ
- No wire stripping required.
- No special tools required for insta
- 3-pin footprint in always closed po
- Totally encapsulated wire connectio
Certificate
- UL Approval shortly
Main Products
Telecom Accessories